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April 17, 2008 -– /CARLSBAD, CA/ -- Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, announces the expansion of its cleanroom assembly area for Palomar Microelectronics assembly services. Palomar has tripled its cleanroom space and increased its prototyping, applications engineering, process development, assembly, and test services capabilities with its new 2,500-square foot (232.26-square meter) Class 100,000 and 500-square foot (46.45-square meter) Class 10,000 cleanrooms. The expansion enables rapid prototyping and fast turn-around so OEMs can get their products into development or to market faster.
Palomar Microelectronics is a segment of Palomar Technologies that provides quick-turn product development, rapid prototyping, test, and assembly services, as well as continued process development during or after manufacturing services, for microelectronic applications. Processes include advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.
"The new cleanroom space allows us to provide microelectronic services for many of the emerging technologies in areas such as MEMS, high bright LEDs, and other advanced packaging applications and to speed delivery of these services to our customers," says Donald Beck, operations manager for Palomar Microelectronics.
About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is one of the world's principal suppliers of automated high-precision wire bonders and component placement systems along with process development and contract assembly services to increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the LED, wireless, photonic, microwave, photovoltaic, computer, automotive, aerospace, and medical industries.
Visit www.palomartechnologies.com
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